The Technical Forum normally takes place during the World Money Fair in Berlin and is the leading conference for modern minting technology worldwide. Just like the WMF, the Technical Forum will happen online this year.
The presentations will be held in four sessions between February and May. The first session will start on 24th February, starting 10am CET, covering the issues Tool Making, Security, and Surface Finishing.
These are the topics of Session 1 and their presenters:
1. Tool Making
Dr. Juri Wehrs (PLATIT): A Newly Developed In-House PVP-Hard Coating System for Coining Dies – S-Mpulse
The Mint Industry has a growing demand for easy to use and environmentally friendly hard coating solutions that substitute the traditional hard chromium processes. Platit meets this demand and presents the S-MPulse – a newly developed, highly sophisticated and cost-efficient In-House PVD-hard coating system, specially designed for coining dies applications.
Dr. Juri Wehrs graduated in Mechanical Engineering at TU-Braunschweig and holds a PhD in Materials Science from ETH. He has been working with Platit AG since 2017 where is responsible for customer sampling and application development.
Benjamin Paganelli (GF Machining Solutions GmbH): Laser Engraving For Minting Dies – Achieving Finest Details Thanks to the Smallest Laser Tool <12um
Introduction of the latest innovative laser engraving solution to achieve Surface quality with no pitting, sharp result with no remelting, and an effective reduction of time processing. Copy finest details possible and transfer it into the machining process – based on a pixels grid deformation. Smallest “free burr” laser tool useable on hardened material, from Standard Casting to Powder Metallurgy.
Benjamin Paganelli started his career in 1996 with Baasel Lasertechnik as Sales Engineer and then joined the company ALLTEC in 1998. In 2006, he started as Managing director in Italy of FOBA GmbH. Since 2010 he is Head of Sales advanced Manufacturing region Europe and South America for GF Machining Solutions.
2. Security
Christoph Frenz (COINstitute GmbH): 3D-Measuring of Reliefs & Minting Desirable Coins
How to create desirable coins? Is it the design? The relief height? The embossing conciseness? This paper will show how the relief of a coin can be measured objectively and how the relief can make a coin desirable. Amongst others this project is supported by Swissmint, the Bavarian State Mint, InduVis, CPI, COINstitute and the German Central Bank.
Christoph Frenz is a metal transformer. Before bringing coins into shape he reconstructed cars after accidents at Mercedes-Benz. 2006 Christoph joined the minting family. 2010 he founded COINstitute to develop security features and new coin series. COINstitute supports mints and central banks around the world to win new markets, create new products and to improve processes. Besides coins Christoph loves different cultures around the globe.
3. Surface Finishing
Ingo Löken (SPALECK Oberflächentechnik GmbH & Co. KG): Ceramic High Definition – A New Finishing Media to Please an Old Desire
In order to achieve an outstanding striking result, highest blank quality is mandatory. This has been and will be a general requirement for the blank surface finishing process. A key role in the finishing process has the finishing media. Unit now the usage of stainless steel balls and satellites has been the “Golden Standard” for the industry. Spaleck has introduced the a new generation of finishing media based on high performance ceramics into the minting industry. The new CHD media is showing outstanding results with regard to striking quality and chemical resistance during the finishing process.
Ingo Löken joined Spaleck as an apprentice to become a millwright. After his practical education, he went to the University of Osnabrück to become an engineer for material since. For 11 years he covered production and sales positions in the field of medical polymers in the plastic industry. Since 2009 he has been acting as a Sales Engineer for the minting industry within the Spaleck organization.
The next sessions will take place on 25 March 2021, the last two will follow in April and May. We will inform you about the session details when the events will be approaching.
To participate, register here.
On Youtube, you can watch a preview with the moderators.
Here you can read our report from the Technical Forum 2018.
